The Uppsala group have been also able to undertake deposition of copper steel by ALD using copper(I) chloride.23 In such cases, the copper metal was deposited on tantalum steel foils, using an evaporation temperature of 350°C as well as a deposition temperature number of 360°C– 410°C. The growth per cycle https://aldtechniques25815.blogocial.com/what-does-thin-film-deposition-mean-54746381